Frontiers in Noncommutative Geometry and Its Applications (26w5604)

The Institute for Advanced Study in Mathematics will host the "Frontiers in Noncommutative Geometry and Its Applications" workshop in Hangzhou, China from July 5 to July 10, 2026.

This workshop will convene leading mathematicians and emerging scholars from across the globe to explore the latest advances and future directions in noncommutative geometry, a dynamic field at the intersection of analysis, geometry, algebra, and mathematical physics. Notably, the event has garnered the participation and support of Fields Medalist Alain Connes, the founder of noncommutative geometry, along with seven other International Congress of Mathematicians (ICM) speakers.

This prestigious event will feature a diverse program that includes survey lectures by prominent figures in the field, specialized research talks, presentations from junior researchers, and panel discussions on open problems in noncommutative geometry. Participants will also have opportunities for collaboration on unsolved challenges through group project sessions. With a balanced mix of established scholarship and cutting-edge research, the workshop aims to foster new international collaborations and advance the frontiers of this evolving mathematical discipline. Co-sponsored by IASM at Zhejiang University, this workshop further highlights the university's growing stature as a global leader in advanced mathematical research.

The Institute for Advanced Study in Mathematics (IASM) in Hangzhou, China, and the Banff International Research Station for Mathematical Innovation and Discovery (BIRS) in Banff, are collaborative Canada-US-Mexico ventures that provide an environment for creative interaction as well as the exchange of ideas, knowledge, and methods within the Mathematical Sciences, with related disciplines and with industry. The research station in Banff is supported by Canada's Natural Science and Engineering Research Council (NSERC), the U.S. National Science Foundation (NSF) and Alberta Technology and Innovation.